World-class researchers, engineers, and industry leaders driving the future of semiconductor design, advanced packaging, and systems integration.
Day 1 · Sunday, December 6, 2026 · Intensive full-day courses across 3 concurrent halls
Days 2–4 · December 7–9, 2026 · Keynote presentations anchoring each technical session
We invite applications from researchers, engineers, and industry executives with groundbreaking insights to share with the global semiconductor packaging community.