Technical Committee
10 Members
IIT Ropar
Prof. Rohit Sharma
Package Design & Architecture
IIT Ropar
BITS Pilani
Prof. Venkatesh KP
Design for Reliability
BITS Pilani
IIT Bombay
Prof. Shiladri Chakraborty
Power Module Design
IIT Bombay
IISc Bangalore
Prof. Praveen C. Ramamurthy
Materials Comp. & Packaging
IISc Bangalore
NIT Calicut
Prof. Murali K P
Materials Comp. & Packaging
NIT Calicut
IIT Bombay
Prof. Pradeep Dixit
Interconnecting Substrates
IIT Bombay
IIT Hyderabad
Prof. Naresh Emani
Integrated Opto-Electronics
IIT Hyderabad
IIT Kanpur
Prof. Nilesh Badwe
IC & Board Assembly
IIT Kanpur
IIT Kharagpur
Prof. Anandaroop Bhattacharya
Thermal Technologies
IIT Kharagpur
IIT Tirupati
Prof. Jaynarayan T Tudu
Substrate, Module & System Test
IIT Tirupati