India's premier global semiconductor conference — from chip design to packaging, systems integration, and beyond.
IEEE-IDSPS 2026 – This conference is an arm of the IDSPS program and its Industry Consortium that Prof. Rao Tummala is developing by creating 9 national industry co development centres at seven IITs, IISc Bangalore and BITS P. It is technically sponsored by IEEE. IEEE- IDSPS being developed as the 5th largest global conference along the lines of ECTC in USA, ESTC in Europe, ICEPT in China
Global recognized technical experts delivering introductory tutorials and insights across key semiconductor and packaging technologies.
Keynote talks from global deep technology experts and by corporate leaders
Panel discussions with industry and academic experts on emerging trends and challenges.
About 30 technical papers will be presented in the conference across 9 strategic technologies
Exhibition space for companies to present cutting-edge technologies, services and solutions.
15 key Industry suppliers presenting the latest tools, materials, and manufacturing technologies.
Policy leaders from both the Central and State Governments will be present.
Connect with global experts, researchers, industry leaders, and innovators.
Experts and organizations from leading semiconductor ecosystems worldwide
Prof. Rao Tummala is the General Chair and Organizer, supported by four global professional societies — IEEE, IMAPS, GEA, SMTA, 10 IITs/IISc, and a minimum of 30 global companies. Prof. Rao Tummala has organized dozens of conferences in the USA and two in India: ISPEC-1 at Chandigarh and ISPEC-2 in Gujarat (https://ispec.co.in/).
The Indian Design, Semiconductors, Packaging & Systems (IDSPS) program is an industry-driven and industry-led initiative to bring India to the forefront of global R&D in AI hardware and integrated power electronics for electric vehicles. IDSPS aims to establish India as a globally-competitive semiconductor manufacturing and product nation. IDSPS Is creating 9 national semi- to- systems technology centers and two system integration centers across India at 11 premier institutions (IITs, IISc, and BITS Pilani), integrating individual advances into system prototypes with state-of-the-art pilot lines in Advanced Packaging Hub at IIT Gandhinagar and the Integrated Power Electronics Hub at IIT Bhubaneswar.
Drives global semiconductor innovation through standards, research leadership, and worldwide technical communities.
Accelerates advanced packaging and microelectronics innovation by connecting global industry and academia.
Unites global electronics leaders from semiconductors to systems to advance next-generation technologies, guidelines, and education.
Advances electronics manufacturing by connecting professionals through education, technical resources, and networking.
IDSPS partnering academic institutions include IIT Tirupati, IISc Bangalore, IIT Gandhinagar, IIT Bhubaneswar, IIT Ropar, BITS Pilani, IIT Kanpur, IIT Kharagpur, IIT Bombay, and IIT Hyderabad. In addition, 50–100 colleges and universities across India and ten or more from the USA, Europe, Japan, and Taiwan are expected to participate.
The conference plans to include all 32 IDSPS Industry Consortium partners, including Intel, Infineon, CDIL, Tessolve, Baba Fine Chemicals, Evatec AG, Resonac, Qualcomm, GlobalFoundries, Ansys, Micron Technology, Lam Research, Texas Instruments, STMicroelectronics, Marvell Technology, NXP Semiconductors, Tata Electronics, Applied Materials, and others. An additional 50–100 companies from India and abroad will be invited.